Author - Eurocircuits TV

Regardless the size of a production batch, it’s important to inspect the first board coming out from the pick & place machine before it moves in to the reflow oven...

Through Hole Technology is not the standard for making electronics anymore. As Surface Mount Technology pushed THT to the background only some components remain Through...

After soldering our PixPect is helping us again to check the quality of the reflow soldering. Prototypes and Small Series require process solutions with minimum setup...

Cleaning, de-panellising and packing are the final but important steps in the whole production process.

Process control and various quality checks during the assembly process should guarantee a flawless production and good quality end product. Nevertheless, no product...

As many boards cary none or just some Through Hole components, wave soldering become more or less obsolete. TH components on predominant SMD populated boards are...

Although we use machines as much as possible even for one off assemblies, yet we cannot avoid that for some boards, manual soldering is necessary. Manual soldering is...

X-Ray inspection is a very useful technique to monitor the quality of our assembly process, especially for components where it is impossible to visually inspects the...