The Eurocircuits Team would like to welcome you at electronica 2018 in Munich, hall C4 booth 400, 13-16 November 2018
Layout A (with pagination)
Via Holes filled with resin have many advantages, one of the most important is the ability to place Via Holes in SMT component pads. This then opens up a whole range of possibilities for designers.
In this episode we will explain the process of Via Hole Filling with resin.
Gyantaval feltoltott furatok – a folyamat.
This 2018 Summer, Eurocircuits TV surprised the student teams in the TU Delft DreamHall with a visit. We met some of the teams and were able to capture some interesting interviews. Dutch spoken – English and German subtitles can be activated. Click the CC link in the bottom right...
Op de laatste dag van de WoTS in Utrecht peilen we samen met Kees de Waal, hoofdredacteur van het vakblad Elektronica naar reacties van bezoekers en standhouders. We spreken ook een laatste keer op de beurs met Paul Petersen van het FHI en blikken vooruit op de E&A beurs in mei 2019...