Through Hole Technology is not the standard for making electronics anymore. As Surface Mount Technology pushed THT to the background only some components remain Through Hole. Therefore the mounting is largely a manual process.

After soldering our PixPect is helping us again to check the quality of the reflow soldering. Prototypes and Small Series require process solutions with minimum setup times as many job changes per day are required in our plant.

Cleaning, de-panellising and packing are the final but important steps in the whole production process.

Process control and various quality checks during the assembly process should guarantee a flawless production and good quality end product. Nevertheless, no product leaves our factory without passing through Final Inspection.

As many boards cary none or just some Through Hole components, wave soldering become more or less obsolete. TH components on predominant SMD populated boards are selectively soldered, with a machine.